應(yīng)用均溫板于非均勻熱物理?xiàng)l件

均溫板(Vapor Chamber)為一兩相流熱傳組件，具有將熱量均勻擴(kuò)散傳遞的功能，非常適合應(yīng)用在不均勻發(fā)熱的熱源條件上。本文主要即是探討均溫板應(yīng)用于非均勻發(fā)熱的電子組件，如CPU、GPU及LED等，其擴(kuò)散傳遞熱量的能力。首先利用本文所開發(fā)的計(jì)算程序VCEK_ML V1及BaseResistance_ML，先行估算均溫板的擴(kuò)散傳遞熱量的能力，再使用窗口軟件VCTM V1.0配合熱性能實(shí)驗(yàn)，分析整個(gè)均溫板模塊在非均勻熱源物理?xiàng)l件的熱流現(xiàn)象，最后可藉由熱顯像儀的溫度分布結(jié)果驗(yàn)證均溫板擴(kuò)散熱量的傳遞能力。結(jié)果顯示，均溫板模塊可有效改善非均勻熱物理?xiàng)l件的熱分布現(xiàn)象，比純銅及純鋁板佳。

 A vapor chamber is a two-phase heat transfer components with a function of spreading and transferring uniformly heat capacity so that it is ideal for use in non-uniform heating conditions. This article mainly researches in vapor chamber application on non-uniform heating electronic components, such as CPU, GPU, and LED, with its ability to spread and heat transfer. Firstly, the calculation program developed in this paper named as VCEK_ML V1 and BaseResistance_ML employ to estimating the ability for spreading and transferring heat amount of vapor chamber. Then the Windows software VCTM V1.0 with the thermal-performance experiment analyzes the thermal phenomena of the Vapor Chamber module in the thermo physical conditions of non-uniform heat source, and finally, a thermal imager can be employed and proved the heat spreading capability of vapor chamber through the temperature distributions. The results showed that, a vapor chamber module can effectively improve the thermo physical conditions of non-uniform heat distribution phenomenon, which is better than pure copper and pure aluminum plates.收起
關(guān)鍵詞：均溫板、非均勻熱源、VCTM1.0、熱分布、熱顯像儀 Vapor Chamber Non-uniform Heater VCTM V1.0 Heat Distribution Thermal Imager